Integrated mechatronic-AME design for cyber-physical smart components and materials

The convergence of mechatronics and Information Technology is driving the development of increasingly sophisticated Cyber-Physical Systems (CPS), which are at the core of the Industry 4.0 revolution. This thesis defines and validates a methodological path for creating integrated components capable of autonomous state-perception and actuation by resolving challenges in smart composites and Additive Manufactured Electronics (AME). The first stage addresses the critical interfacial integrity between Shape Memory Alloys (SMAs) and polymer matrices. By implementing an innovative elastomeric interlayer, the research successfully mitigated residual thermal stresses. Experimental validation achieved a breakthrough result: the tensile fracture of the SMA wire occurred before interfacial debonding, proving that engineered interfaces can surpass the actuator's own structural strength, enabling high-performance morphing structures. The second stage develops the "cyber" element via multi-material inkjet technology. This work conducts the first systematic electromechanical characterization of printed components under mechanical stress, establishing design guidelines for functional reliability. The approach was validated through a 3D-printed strain gauge with a highly linear response (R^2=0.99), performing on par with commercial sensors. The research culminates in a self-sensing actuator for soft robotics, monolithically integrating SMA actuation and capacitive sensing within a PDMS matrix. A critical innovation is the thermal compensation model that decouples strain signals from thermal interference, resulting in an artificial muscle with a high force-to-weight ratio (~100:1) and real-time proprioceptive feedback. Finally, the work validates an AME-scalable workflow by demonstrating direct inkjet printing of sensors onto elastomeric matrices. In conclusion, this thesis provides validated engineering solutions for active composites and printed electronics, demonstrating how their synergy enables a new generation of cyber-physical components for soft robotics, wearables, and autonomous structures.