Design and Fabrication of Bond Wire Micro-Magnetics

Macrelli, Enrico (2014) Design and Fabrication of Bond Wire Micro-Magnetics, [Dissertation thesis], Alma Mater Studiorum Università di Bologna. Dottorato di ricerca in Tecnologie dell'informazione, 26 Ciclo. DOI 10.6092/unibo/amsdottorato/6426.
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This thesis presents a new approach for the design and fabrication of bond wire magnetics for power converter applications by using standard IC gold bonding wires and micro-machined magnetic cores. It shows a systematic design and characterization study for bond wire transformers with toroidal and race-track cores for both PCB and silicon substrates. Measurement results show that the use of ferrite cores increases the secondary self-inductance up to 315 µH with a Q-factor up to 24.5 at 100 kHz. Measurement results on LTCC core report an enhancement of the secondary self-inductance up to 23 µH with a Q-factor up to 10.5 at 1.4 MHz. A resonant DC-DC converter is designed in 0.32 µm BCD6s technology at STMicroelectronics with a depletion nmosfet and a bond wire micro-transformer for EH applications. Measures report that the circuit begins to oscillate from a TEG voltage of 280 mV while starts to convert from an input down to 330 mV to a rectified output of 0.8 V at an input of 400 mV. Bond wire magnetics is a cost-effective approach that enables a flexible design of inductors and transformers with high inductance and high turns ratio. Additionally, it supports the development of magnetics on top of the IC active circuitry for package and wafer level integrations, thus enabling the design of high density power components. This makes possible the evolution of PwrSiP and PwrSoC with reliable highly efficient magnetics.

Tipologia del documento
Tesi di dottorato
Macrelli, Enrico
Dottorato di ricerca
Scuola di dottorato
Scienze e ingegneria dell'informazione
Settore disciplinare
Settore concorsuale
Parole chiave
bonding wires, bond wire, converter, DC-DC, energy harvesting, fabrication, ferrite, high-frequency, inductors, LTCC, magnetics, on-chip, oscillator, PCB, power converters, power supply in package, power supply on chip, resonant, silicon, TEG, toroidal, transformers.
Data di discussione
28 Aprile 2014

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